Panel Discussion on FDI (Field Device Integration)

A highlight on the joint PI booth on the Hanover Fair evidently was the panel discussion on FDI (Field Device Integration) on April 20, 2010. Chaired by Dr. Thomas Tauchnitz well-known representatives of companies active within the FDI Corporation discussed about the future requirements of a uniform and efficient device integration as well as the chances and further developments of FDI. Due to the flight ban not all scheduled participants were able to manage to come to Germany. The following participants attended the panel discussion: Kimikazu Takahashi (Yokogawa), Daniel Huber (ABB), Hans-Georg Kumpfmüller (Siemens), Dr. Raimund Sommer (E+H) and Hartmut Wallraf (Invensys).